Description
eSUN High Temp Resin (HT100)
Ultra High Temperature Resistant Resin 280°C for Molds and Advanced Engineering Applications
Experience the pinnacle of 3D printing materials with eSUN High Temp Resin. This engineering resin is designed to break thermal barriers, with a heat resistance of up to 280°C, making it the ultimate material for creating molds, machine parts, and prototypes that need to perform in extreme conditions.
Why choose eSUN High Temp Resin (HT100)?
Extreme Heat Resistance: With an HDT value exceeding 280°C (at 0.45MPa), printed parts maintain their shape perfectly, without deformation even under continuous high heat.
High Hardness and Dimensional Stability: Designed for high rigidity and low shrinkage, ideal for applications requiring micron-level precision.
Environmental Durability: In addition to heat resistance, it offers excellent resistance to chemicals and weathering. Parts do not become brittle after heat treatment.
Industrial Application Support: Suitable for LCD and DLP printers that demand high-quality results comparable to injection-molded parts.
Applications
Mold Making: For printing molds for plastic casting or molds that require resistance to compression and heat.
Automotive and Machine Parts: Components that are exposed to heat sources or need to undergo high-temperature testing.
Electronic Devices: For making protective parts or connectors that must withstand accumulated heat.
Industrial Dentistry: For models that require high-temperature processing.
Key Technical Specifications
Heat Deflection Temp (HDT): >280°C (after post-curing)
Hardness: 82-84D (Shore D)
Tensile Strength: 53.3 MPa
Flexural Strength: 92.7 MPa
Viscosity: 180-220 mPa·s (Good flowability, easy to print)
Tips for Optimal Performance (Post-Processing)
To achieve the specified 280°C heat resistance, the following steps are necessary:
Post-curing: UV cure for more than 10 minutes.
Heat Treatment: Place the part in a heat oven at 150°C for 30 minutes to fully cure the polymer structure.
