Description
eSUN High Temp Resin (HT100)
Special High Temperature Resistant Resin 280°C for Molds and Advanced Engineering Applications
Experience the pinnacle of 3D printing materials with eSUN High Temp Resin. This engineering resin is designed to break thermal barriers, boasting a high-temperature resistance of up to 280°C, making it the ultimate material for creating molds, machine parts, and prototypes that must perform in extreme conditions.
Why choose eSUN High Temp Resin (HT100)?
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Extreme Heat Resistance: Features an HDT greater than 280°C (at 0.45MPa). Printed parts maintain their shape perfectly, without deformation even under continuous high heat.
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High Hardness and Dimensional Stability: Designed for high rigidity and low shrinkage, ideal for applications requiring micron-level precision.
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Environmental Durability: In addition to heat resistance, it offers excellent chemical and weather resistance. Parts do not become brittle after heat treatment.
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Industrial Application Support: Suitable for LCD and DLP printers that require high-quality parts comparable to injection-molded components.
Applications
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Mold Making: Used for printing molds for plastic casting or molds that require resistance to pressure and heat.
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Automotive and Machine Parts: Components that are close to heat sources or need to undergo high-temperature testing.
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Electronic Devices: Used for making protective parts or connectors that need to withstand accumulated heat.
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Industrial Dentistry: For models that need to undergo high-temperature processes.
Key Technical Specifications
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Heat Deflection Temp (HDT): >280°C (after post-curing)
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Hardness: 82-84D (Shore D)
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Tensile Strength: 53.3 MPa
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Flexural Strength: 92.7 MPa
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Viscosity: 180-220 mPa·s (good flow, easy to print)
Tips for Maximum Performance (Post-Processing)
To achieve the specified 280°C heat resistance, follow these steps:
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Post-curing: UV cure for more than 10 minutes.
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Heat Treatment: Place the part in a heat oven at 150°C for 30 minutes to fully set the polymer structure.
